Leave Your Message
Century Seals joins hands with Kovar technology pioneer to reshape the industry benchmark for high-reliability sealing solutions

News

Century Seals joins hands with Kovar technology pioneer to reshape the industry benchmark for high-reliability sealing solutions

2025-05-22
The global electronic packaging and high-airtightness component market is experiencing a wave of technological iteration to meet the reliability and miniaturization requirements in extreme environments. Recently, Century Seals announced that it will fully introduce Kovar packaging technology in its new aerospace-grade microwave device sealing solution. Through material and process innovation, it will solve the pain points of insufficient sealing of high-frequency communications and energy equipment, and provide long-term protection for semiconductors, deep-sea exploration and new energy vehicle systems.
Century Seals joins hands with Kovar technology pioneer to reshape the industry benchmark for high-reliability sealing solutions
01

Century Seals joins hands with Kovar technology pioneer to reshape the industry benchmark for high-reliability sealing solutions

Short Description:

Century Seals' core scenarios include satellite communications (Ka band) and EV battery pack sealing, which require packaging materials to maintain structural stability under -196°C to 450°C (liquid nitrogen to high temperature cycle) conditions.
The traditional 316L stainless steel shell has a high-frequency welding failure rate of up to 15% due to differences in the coefficient of thermal expansion (CTE). The Kovar alloy solution (CTE 5.1×10⁻⁶/°C) of this cooperation achieves submicron-level bonding with alumina ceramic substrates, allowing the device to maintain a vacuum degree of <5×10⁻⁴ Pa for more than 10 years, and the leakage rate is reduced by 80% compared with traditional solutions. At the same time, the ultra-low magnetism of Kovar alloy (μ<1.05) avoids microwave signal distortion, supports the 28GHz frequency band transmission of 6G communication modules, and reduces signal loss to 0.2dB/cm.

Green manufacturing: closed-loop production and low-carbon process upgrade

In response to Century Seals' 2030 zero waste goal, Kovar alloy suppliers optimized the metal powder metallurgy process, increased material utilization to 97%, and achieved 99.3% recycling of precious metals such as cobalt and nickel through electrolytic recycling technology. In addition, the production process has passed ISO 14064 carbon footprint certification, and the carbon emissions of a single shell are reduced by 42% compared with traditional casting processes. Its products comply with the environmental risk control requirements for power battery shell materials in the EU's "New Battery Regulation" (EU 2023/1542), helping customers expand into the European new energy vehicle market.

Certification plus: Expanding high-barrier scene applications

In order to meet Century Seals' stringent standards in the military and medical fields, Kovar Alloy Technology has obtained MIL-STD-883H military grade certification and ISO 13485 medical device packaging system qualifications in advance, and developed an anti-hydrogen sulfide coating process (H2S corrosion resistance > 2000 hours) to adapt to strong corrosion scene applications such as petroleum sensors. In response to the fire protection needs of energy storage cabinets, the two parties jointly launched a flame-retardant composite packaging structure, which passed the UL 94 V-0 test and achieved self-extinguishing within 3 seconds, seizing the North American energy storage system market.

Co-evolution: Building an intelligent packaging ecosystem

The two parties plan to jointly build a joint laboratory for miniaturized packaging by 2025, focusing on the development of the laser selective melting (SLM) 3D printing process to compress the wall thickness of the Kovar alloy shell to 0.15mm±0.02mm, supporting the CPO (co-packaged optics) integration of optical modules. Century Seals CTO said: "The ductility of Kovar alloy combined with our precision micro-welding technology will redefine the packaging limit of high-frequency devices and provide basic support for quantum communications and space Internet."